Advanced Electronic Packaging
-15%
portes grátis
Advanced Electronic Packaging
Ulrich, Richard K.; Brown, William D.
John Wiley & Sons Inc
05/2006
848
Dura
Inglês
9780471466093
15 a 20 dias
1662
Descrição não disponível.
Chapter 1: Introduction and overview of microelectronic packaging. Chapter 2: Materials for microelectronic packaging.
Chapter 3: Processing technologies.
Chapter 4: Organic printed circuit board materials and processes.
Chapter 5: Ceramic substrates.
Chapter 6: Electrical considerations, modeling, and simulation.
Chapter 7: Thermal considerations.
Chapter 8: Mechanical design considerations.
Chapter 9: Discrete and embedded passive devices.
Chapter 10: Electronic package assembly.
Chapter 11: Design considerations.
Chapter 12: Radio frequency and microwave packaging.
Chapter 13: Power electronics packaging.
Chapter 14: Multichip and three-dimensional packaging.
Chapter 15: Packaging of MEMS and MOEMS: challenges and a case study.
Chapter 16: Reliability considerations.
Chapter 17: Cost evaluation and analysis.
Chapter 18: Analytical techniques for materials characterization.
Chapter 3: Processing technologies.
Chapter 4: Organic printed circuit board materials and processes.
Chapter 5: Ceramic substrates.
Chapter 6: Electrical considerations, modeling, and simulation.
Chapter 7: Thermal considerations.
Chapter 8: Mechanical design considerations.
Chapter 9: Discrete and embedded passive devices.
Chapter 10: Electronic package assembly.
Chapter 11: Design considerations.
Chapter 12: Radio frequency and microwave packaging.
Chapter 13: Power electronics packaging.
Chapter 14: Multichip and three-dimensional packaging.
Chapter 15: Packaging of MEMS and MOEMS: challenges and a case study.
Chapter 16: Reliability considerations.
Chapter 17: Cost evaluation and analysis.
Chapter 18: Analytical techniques for materials characterization.
Este título pertence ao(s) assunto(s) indicados(s). Para ver outros títulos clique no assunto desejado.
electronic; changes; edition; industry; reflects; feedback; students; publication; first; consistent; level; experts; familiar; key; several; readers; example; chapters; substrates; ceramic
Chapter 1: Introduction and overview of microelectronic packaging. Chapter 2: Materials for microelectronic packaging.
Chapter 3: Processing technologies.
Chapter 4: Organic printed circuit board materials and processes.
Chapter 5: Ceramic substrates.
Chapter 6: Electrical considerations, modeling, and simulation.
Chapter 7: Thermal considerations.
Chapter 8: Mechanical design considerations.
Chapter 9: Discrete and embedded passive devices.
Chapter 10: Electronic package assembly.
Chapter 11: Design considerations.
Chapter 12: Radio frequency and microwave packaging.
Chapter 13: Power electronics packaging.
Chapter 14: Multichip and three-dimensional packaging.
Chapter 15: Packaging of MEMS and MOEMS: challenges and a case study.
Chapter 16: Reliability considerations.
Chapter 17: Cost evaluation and analysis.
Chapter 18: Analytical techniques for materials characterization.
Chapter 3: Processing technologies.
Chapter 4: Organic printed circuit board materials and processes.
Chapter 5: Ceramic substrates.
Chapter 6: Electrical considerations, modeling, and simulation.
Chapter 7: Thermal considerations.
Chapter 8: Mechanical design considerations.
Chapter 9: Discrete and embedded passive devices.
Chapter 10: Electronic package assembly.
Chapter 11: Design considerations.
Chapter 12: Radio frequency and microwave packaging.
Chapter 13: Power electronics packaging.
Chapter 14: Multichip and three-dimensional packaging.
Chapter 15: Packaging of MEMS and MOEMS: challenges and a case study.
Chapter 16: Reliability considerations.
Chapter 17: Cost evaluation and analysis.
Chapter 18: Analytical techniques for materials characterization.
Este título pertence ao(s) assunto(s) indicados(s). Para ver outros títulos clique no assunto desejado.
