Copper
-15%
portes grátis
Copper
Fundamental Mechanisms for Microelectronic Applications
Gutmann, Ronald J.; Murarka, Shyam P.; Verner, Igor V.
John Wiley and Sons Ltd
05/2000
338
Dura
Inglês
9780471252566
0471252565
15 a 20 dias
648
While aluminum is used for microelectronic applications at present, many researchers believe that copper's superior performance will make it the substance of choice for future integrated circuits. This book presents for the first time the fundamentals and application of copper in electronic materials.
Overview of IC Interconnects. Behavior of Copper Impurity Atoms. Copper-Related Defects in Silicon. Chemistry and Electrochemistry. Copper in Inorganic Dielectrics. Copper in Organic Dielectrics (Polymers). Diffusion and Compound Formation. Layered Structures Containing Copper. Copper for IC Metallization. Future Directions in Copper Technology. Appendix. Index.
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While aluminum is used for microelectronic applications at present, many researchers believe that copper's superior performance will make it the substance of choice for future integrated circuits. This book presents for the first time the fundamentals and application of copper in electronic materials.
Overview of IC Interconnects. Behavior of Copper Impurity Atoms. Copper-Related Defects in Silicon. Chemistry and Electrochemistry. Copper in Inorganic Dielectrics. Copper in Organic Dielectrics (Polymers). Diffusion and Compound Formation. Layered Structures Containing Copper. Copper for IC Metallization. Future Directions in Copper Technology. Appendix. Index.
Este título pertence ao(s) assunto(s) indicados(s). Para ver outros títulos clique no assunto desejado.
