Quality Conformance and Qualification of Microelectronic Packages and Interconnects
-15%
portes grátis
Quality Conformance and Qualification of Microelectronic Packages and Interconnects
Evans, Jillian Y.; Dasgupta, Abhijit; Pecht, Michael; Evans, John W.
John Wiley & Sons Inc
01/1995
496
Mole
Inglês
9780471594369
15 a 20 dias
888
Descrição não disponível.
Three-Dimensional Stacked Dies.
Cofired Ceramic Substrates.
Organic Laminated Substrates and Chip-on-Board.
High-Density Interconnects and Deposited Dielectrics.
Wire and Wirebonds.
Tape Automated Bonds.
Flip-Chip Bonds.
Device and Substrate Attachment.
Cases.
Leads.
Lead Seals.
Lid Seals.
Material and Product Evaluation Methods.
Rework Methods.
Bibliography.
Index.
Cofired Ceramic Substrates.
Organic Laminated Substrates and Chip-on-Board.
High-Density Interconnects and Deposited Dielectrics.
Wire and Wirebonds.
Tape Automated Bonds.
Flip-Chip Bonds.
Device and Substrate Attachment.
Cases.
Leads.
Lead Seals.
Lid Seals.
Material and Product Evaluation Methods.
Rework Methods.
Bibliography.
Index.
Este título pertence ao(s) assunto(s) indicados(s). Para ver outros títulos clique no assunto desejado.
technologists; highest; engineers; quality; costeffective; paradigm; products; failure; costeffectively; milstds; potential; address; government; towards; controls; causes; costeffective process; decisively; appropriate; root; implementation
Three-Dimensional Stacked Dies.
Cofired Ceramic Substrates.
Organic Laminated Substrates and Chip-on-Board.
High-Density Interconnects and Deposited Dielectrics.
Wire and Wirebonds.
Tape Automated Bonds.
Flip-Chip Bonds.
Device and Substrate Attachment.
Cases.
Leads.
Lead Seals.
Lid Seals.
Material and Product Evaluation Methods.
Rework Methods.
Bibliography.
Index.
Cofired Ceramic Substrates.
Organic Laminated Substrates and Chip-on-Board.
High-Density Interconnects and Deposited Dielectrics.
Wire and Wirebonds.
Tape Automated Bonds.
Flip-Chip Bonds.
Device and Substrate Attachment.
Cases.
Leads.
Lead Seals.
Lid Seals.
Material and Product Evaluation Methods.
Rework Methods.
Bibliography.
Index.
Este título pertence ao(s) assunto(s) indicados(s). Para ver outros títulos clique no assunto desejado.
