SemiConductor Wafer Bonding
-15%
portes grátis
SemiConductor Wafer Bonding
Science and Technology
Tong, Q.-Y.; Goesele, U.
John Wiley & Sons Inc
12/1998
320
Dura
Inglês
9780471574811
15 a 20 dias
654
Descrição não disponível.
Basics of Interactions Between Flat Surfaces.
Influence of Particles, Surface Steps, and Cavities.
Surface Preparation and Room-Temperature Wafer Bonding.
Thermal Treatment of Bonded Wafer Pairs.
Thinning Procedures.
Electrical Properties of Bonding Interfaces.
Stresses in Bonded Wafers.
Bonding of Dissimilar Materials.
Bonding of Structured Wafers.
Mainstream Applications.
Emerging and Future Applications.
Index.
Influence of Particles, Surface Steps, and Cavities.
Surface Preparation and Room-Temperature Wafer Bonding.
Thermal Treatment of Bonded Wafer Pairs.
Thinning Procedures.
Electrical Properties of Bonding Interfaces.
Stresses in Bonded Wafers.
Bonding of Dissimilar Materials.
Bonding of Structured Wafers.
Mainstream Applications.
Emerging and Future Applications.
Index.
Este título pertence ao(s) assunto(s) indicados(s). Para ver outros títulos clique no assunto desejado.
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Basics of Interactions Between Flat Surfaces.
Influence of Particles, Surface Steps, and Cavities.
Surface Preparation and Room-Temperature Wafer Bonding.
Thermal Treatment of Bonded Wafer Pairs.
Thinning Procedures.
Electrical Properties of Bonding Interfaces.
Stresses in Bonded Wafers.
Bonding of Dissimilar Materials.
Bonding of Structured Wafers.
Mainstream Applications.
Emerging and Future Applications.
Index.
Influence of Particles, Surface Steps, and Cavities.
Surface Preparation and Room-Temperature Wafer Bonding.
Thermal Treatment of Bonded Wafer Pairs.
Thinning Procedures.
Electrical Properties of Bonding Interfaces.
Stresses in Bonded Wafers.
Bonding of Dissimilar Materials.
Bonding of Structured Wafers.
Mainstream Applications.
Emerging and Future Applications.
Index.
Este título pertence ao(s) assunto(s) indicados(s). Para ver outros títulos clique no assunto desejado.
